JPS61265232A - チップ実装装置 - Google Patents
チップ実装装置Info
- Publication number
- JPS61265232A JPS61265232A JP60107530A JP10753085A JPS61265232A JP S61265232 A JPS61265232 A JP S61265232A JP 60107530 A JP60107530 A JP 60107530A JP 10753085 A JP10753085 A JP 10753085A JP S61265232 A JPS61265232 A JP S61265232A
- Authority
- JP
- Japan
- Prior art keywords
- type
- electronic parts
- electronic components
- mounts
- tray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012856 packing Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 12
- 238000000034 method Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Automatic Assembly (AREA)
- Specific Conveyance Elements (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60107530A JPS61265232A (ja) | 1985-05-20 | 1985-05-20 | チップ実装装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60107530A JPS61265232A (ja) | 1985-05-20 | 1985-05-20 | チップ実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61265232A true JPS61265232A (ja) | 1986-11-25 |
JPH0516974B2 JPH0516974B2 (en]) | 1993-03-05 |
Family
ID=14461526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60107530A Granted JPS61265232A (ja) | 1985-05-20 | 1985-05-20 | チップ実装装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61265232A (en]) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005032233A1 (de) * | 2003-09-23 | 2005-04-07 | Siemens Aktiengesellschaft | Vorrichtung zum bestücken von substraten mit elektrischen bauelementen |
JP2006140255A (ja) * | 2004-11-11 | 2006-06-01 | Matsushita Electric Ind Co Ltd | 部品実装方法 |
CN106002154A (zh) * | 2016-07-06 | 2016-10-12 | 张帆 | 端子线组装方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59115131A (ja) * | 1982-12-20 | 1984-07-03 | Matsushita Electric Ind Co Ltd | 部品・治具供給装置 |
JPS60107527A (ja) * | 1983-11-16 | 1985-06-13 | Orion Mach Co Ltd | 搾乳機用乳量測定装置 |
-
1985
- 1985-05-20 JP JP60107530A patent/JPS61265232A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59115131A (ja) * | 1982-12-20 | 1984-07-03 | Matsushita Electric Ind Co Ltd | 部品・治具供給装置 |
JPS60107527A (ja) * | 1983-11-16 | 1985-06-13 | Orion Mach Co Ltd | 搾乳機用乳量測定装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005032233A1 (de) * | 2003-09-23 | 2005-04-07 | Siemens Aktiengesellschaft | Vorrichtung zum bestücken von substraten mit elektrischen bauelementen |
JP2006140255A (ja) * | 2004-11-11 | 2006-06-01 | Matsushita Electric Ind Co Ltd | 部品実装方法 |
CN106002154A (zh) * | 2016-07-06 | 2016-10-12 | 张帆 | 端子线组装方法 |
CN106002154B (zh) * | 2016-07-06 | 2018-03-09 | 张帆 | 端子线组装方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0516974B2 (en]) | 1993-03-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |